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LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers; 128/256 kB ISP/IAP Flash with 10-bit ADC
Rev. 01 -- 18 November 2003 Preliminary data
1. General description
The LPC2114/LPC2124 are based on a 16/32 bit ARM7TDMI-STM CPU with real-time emulation and embedded trace support, together with 128/256 kilobytes (kB) of embedded high speed flash memory. A 128-bit wide memory interface and a unique accelerator architecture enable 32-bit code execution at maximum clock rate. For critical code size applications, the alternative 16-bit Thumb Mode reduces code by more than 30% with minimal performance penalty. With their compact 64 pin package, low power consumption, various 32-bit timers, 4-channel 10-bit ADC, PWM channels and 46 GPIO lines with up to 9 external interrupt pins these microcontrollers are particularly suitable for industrial control, medical systems, access control and point-of-sale. With a wide range of serial communications interfaces, they are also very well suited for communication gateways, protocol converters and embedded soft modems as well as many other general-purpose applications.
2. Features
2.1 Key features
s 16/32-bit ARM7TDMI-S microcontroller in a tiny LQFP64 package. s 16 kB on-chip Static RAM. s 128/256 kB on-chip Flash Program Memory. 128-bit wide interface/accelerator enables high speed 60 MHz operation. s In-System Programming (ISP) and In-Application Programming (IAP) via on-chip boot-loader software. Flash programming takes 1 ms per 512 byte line. Single sector or full chip erase takes 400 ms. s EmbeddedICE-RT interface enables breakpoints and watch points. Interrupt service routines can continue to execute whilst the foreground task is debugged with the on-chip RealMonitor software. s Embedded Trace Macrocell enables non-intrusive high speed real-time tracing of instruction execution. s Four channel 10-bit A/D converter with conversion time as low as 2.44 s. s Two 32-bit timers (with 4 capture and 4 compare channels), PWM unit (6 outputs), Real Time Clock and Watchdog. s Multiple serial interfaces including two UARTs (16C550), Fast I2C (400 kbits/s) and two SPIsTM. s 60 MHz maximum CPU clock available from programmable on-chip Phase-Locked Loop. s Vectored Interrupt Controller with configurable priorities and vector addresses.
Philips Semiconductors
LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
s Up to forty-six 5 V tolerant general purpose I/O pins. Up to 9 edge or level sensitive external interrupt pins available. s On-chip crystal oscillator with an operating range of 10 MHz to 25 MHz. s Two low power modes, Idle and Power-down. s Processor wake-up from Power-down mode via external interrupt. s Individual enable/disable of peripheral functions for power optimization. s Dual power supply: x CPU operating voltage range of 1.65 V to 1.95 V (1.8 V 0.15 V). x I/O power supply range of 3.0 V to 3.6 V (3.3 V 10%) with 5 V tolerant I/O pads.16/32-bit ARM7TDMI-S processor.
3. Ordering information
Table 1: Ordering information Package Name LPC2114FBD64 LPC2124FBD64 LQFP64 LQFP64 Description Version plastic low profile quad flat package, 64 leads, SOT314-2 body 10 x 10 x 1.4 mm plastic low profile quad flat package, 64 leads, SOT314-2 body 10 x 10 x 1.4 mm Type number
3.1 Ordering options
Table 2: Part options Flash memory 128 kB 256 kB RAM 16 kB 16 kB CAN Temperature range (C) -40 to +85 -40 to +85 Type number LPC2114FBD64 LPC2124FBD64
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Philips Semiconductors
LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
4. Block diagram
TRST(1) TMS(1) TCK(1) TDI(1) TDO(1)
RTCK
XTAL1
XTAL2
RST V3 V1.8 SCL* SDA* SCK* MOSI* MISO* SSEL*
TEST/DEBUG INTERFACE
EMULATION TRACE MODULE
PLL system clock
SYSTEM FUNCTIONS
ARM7TDMI-S
AHB BRIDGE ARM7 LOCAL BUS
VECTORED INTERRUPT CONTROLLER
AMBA AHB (Advanced High-performance Bus)
INTERNAL SRAM CONTROLLER
INTERNAL FLASH CONTROLLER AHB TO VPB VPB BRIDGE DIVIDER
AHB DECODER
16 kB SRAM
128/256 kB FLASH
EINT0* EINT1* EINT2* EINT3* EXTERNAL INTERRUPTS
APB I2C SERIAL INTERFACE
8 x CAP* 8 x MAT*
CAPTURE/ COMPARE TIMER0/TIMER1
SPI SERIAL INTERFACE 0 & 1
TxD0,1* PWM1..6* PWM0 RxD0,1* UART0/UART1
MODEM CONTROL (6 PINS)*
P0 (30 PINS) P1.31:16 GENERAL PURPOSE I/O REAL TIME CLOCK
Ain3:0*
10-BIT A/D CONVERTER
WATCHDOG TIMER
SYSTEM CONTROL
*Shared with GPIO
002aaa659
(1) When test/debug interface is used, GPIO/other functions sharing these pins are not available.
Fig 1. Block diagram.
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Preliminary data
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VSS
3 of 36
Philips Semiconductors
LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
5. Pinning information
5.1 Pinning
54 P0.19/MAT1.2/MOSI1/CAP1.2 53 P0.18/CAP1.3/MISO1/MAT1.3 55 P0.20/MAT1.3/SSEL1/EINT3
58 VSSA_PLL
52 P1.30/TMS
56 P1.29/TCK
64 P1.27/TD0
60 P1.28/TDI
57 RESET
62 XTAL1
61 XTAL2
59 VSSA
63 V18A
50 VSS
handbook, full pagewidth
P0.21/PWM5/CAP1.3 1 P0.22/CAP0.0/MAT0.0 2 P0.23 3 P1.19/TRACEPKT3 4 P0.24 5 VSS 6 V3A 7 P1.18/TRACEPKT2 8
49 V18
51 V3
48 P1.20/TRACESYNC 47 P0.17/CAP1.2/SCK1/MAT1.2 46 P0.16/EINT0/MAT0.2/CAP0.2 45 P0.15/RI1/EINT2 44 P1.21/PIPESTAT0 43 V3 42 VSS 41 P0.14/DCD1/EINT1
LPC2114/LPC2124
P0.25 9 NC 10 P0.27/AIN0/CAP0.1/MAT0.1 11 P1.17/TRACEPKT1 12 P0.28/AIN1/CAP0.2/MAT0.2 13 P0.29/AIN2/CAP0.3/MAT0.3 14 P0.30/AIN3/EINT3/CAP0.0 15 P1.16/TRACEPKT0 16
V18 17 VSS 18 P0.0/TxD0/PWM1 19 P1.31/TRST 20 P0.1/RxD0/PWM3/EINT0 21 P0.2/SCL/CAP0.0 22 V3 23 P1.26/RTCK 24 VSS 25 P0.3/SDA/MAT0.0/EINT1 26 P0.4/SCK0/CAP0.1 27 P1.25/EXTIN0 28 P0.5/MISO0/MAT0.1 29 P0.6/MOSI0/CAP0.2 30 P0.7/SSEL0/PWM2/EINT2 31 P1.24/TRACECLK 32
40 P1.22/PIPESTAT1 39 P0.13/DTR1/MAT1.1 38 P0.12/DSR1/MAT1.0 37 P0.11/CTS1/CAP1.1 36 P1.23/PIPESTAT2 35 P0.10/RTS1/CAP1.0 34 P0.9/RxD1/PWM6/EINT3 33 P0.8/TxD1/PWM4
002aaa660
Fig 2. Pinning.
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LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
5.2 Pin description
Table 3: Symbol P0.0 to P0.31 Pin description Pin Type Description Port 0: Port 0 is a 32-bit bi-directional I/O port with individual direction controls for each bit. The operation of port 0 pins depends upon the pin function selected via the Pin Connect Block. Pins 26 and 31 of port 0 are not available. 19, 21, 22, I/O 26, 27, 29-31, 33-35, 37-39, 41, 45-47, 53-55, 1-3, 5, 9, 11, 13-15 19 21 O O P0.1 I O I P0.2 P0.3 22 26 I/O I I/O O I P0.4 P0.5 27 29 I/O I I/O O P0.6 30 I/O I P0.7 31 I O I P0.8 P0.9 33 34 O O I O I P0.10 P0.11 35 37 O I I
P0.0
TxD0 -- Transmitter output for UART0. PWM1 -- Pulse Width Modulator output 1. RxD0 -- Receiver input for UART0. PWM3 -- Pulse Width Modulator output 3. EINT0 -- External interrupt 0 input SCL -- I2C clock input/output. Open drain output (for I2C compliance). CAP0.0 -- Capture input for Timer0, channel 0. SDA -- I2C data input/output. Open drain output (for I2C compliance). MAT0.0 -- Match output for Timer0, channel 0. EINT1 -- External interrupt 1 input. SCK0 -- Serial clock for SPI0. SPI clock output from master or input to slave. CAP0.1 -- Capture input for Timer0, channel 1. MISO0 -- Master In Slave OUT for SPI0. Data input to SPI master or data output from SPI slave. MAT0.1 -- Match output for Timer0, channel 1. MOSI0 -- Master Out Slave In for SPI0. Data output from SPI master or data input to SPI slave. CAP0.2 -- Capture input for Timer0, channel 2. SSEL0 -- Slave Select for SPI0. Selects the SPI interface as a slave. PWM2 -- Pulse Width Modulator output 2. EINT2 -- External interrupt 2 input. TxD1 -- Transmitter output for UART1. PWM4 -- Pulse Width Modulator output 4. RxD1 -- Receiver input for UART1. PWM6 -- Pulse Width Modulator output 6. EINT3 -- External interrupt 3 input. RTS1 -- Request to Send output for UART1. CAP1.0 -- Capture input for Timer1, channel 0. CTS1 -- Clear to Send input for UART1.
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LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
Table 3: Symbol P0.12 P0.13 P0.14 P0.15 P0.16
Pin description...continued Pin 38 39 41 45 46 Type I I O O O I I I I I O I Description CAP1.1 -- Capture input for Timer1, channel 1. DSR1 -- Data Set Ready input for UART1. MAT1.0 -- Match output for Timer1, channel 0. DTR1 -- Data Terminal Ready output for UART1. MAT1.1 -- Match output for Timer1, channel 1. DCD1 -- Data Carrier Detect input for UART1. EINT1 -- External interrupt 1 input. RI1 -- Ring Indicator input for UART1. EINT2 -- External interrupt 2 input. EINT0 -- External interrupt 0 input. MAT0.2 -- Match output for Timer0, channel 2. CAP0.2 -- Capture input for Timer0, channel 2. CAP1.2 -- Capture input for Timer1, channel 2. SCK1 -- Serial Clock for SPI1. SPI clock output from master or input to slave. MAT1.2 -- Match output for Timer1, channel 2. CAP1.3 -- Capture input for Timer1, channel 3. MISO1 -- Master In Slave Out for SPI1. Data input to SPI master or data output from SPI slave. MAT1.3 -- Match output for Timer1, channel 3. MAT1.2 -- Match output for Timer1, channel 2. MOSI1 -- Master Out Slave In for SPI1. Data output from SPI master or data input to SPI slave. CAP1.2 -- Capture input for Timer1, channel 2. MAT1.3 -- Match output for Timer1, channel 3. SSEL1 -- Slave Select for SPI1. Selects the SPI interface as a slave. EINT3 -- External interrupt 3 input. PWM5 -- Pulse Width Modulator output 5. CAP1.3 -- Capture input for Timer1, channel 3. CAP0.0 -- Capture input for Timer0, channel 0. MAT0.0 -- Match output for Timer0, channel 0. General purpose bidirectional digital port only. General purpose bidirectional digital port only. General purpose bidirectional digital port only. AIN0 -- A/D converter, input 0. This analog input is always connected to its pin. CAP0.1 -- Capture input for Timer0, channel 1. MAT0.1 -- Match output for Timer0, channel 1.
P0.17
47
I I/O O
P0.18
53
I I/O O
P0.19
54
O I/O I
P0.20
55
O I I
P0.21 P0.22 P0.23 P0.24 P0.25 P0.27
1 2 3 5 39 11
O I I O I/O I/O I/O I I O
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LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
Table 3: Symbol P0.28
Pin description...continued Pin 13 Type I I O Description AIN1 -- A/D converter, input 1. This analog input is always connected to its pin. CAP0.2 -- Capture input for Timer0, channel 2. MAT0.2 -- Match output for Timer0, channel 2. AIN2 -- A/D converter, input 2. This analog input is always connected to its pin. CAP0.3 -- Capture input for Timer0, Channel 3. MAT0.3 -- Match output for Timer0, channel 3. AIN3 -- A/D converter, input 3. This analog input is always connected to its pin. EINT3 -- External interrupt 3 input. CAP0.0 -- Capture input for Timer0, channel 0. Port 1: Port 1 is a 32-bit bi-directional I/O port with individual direction controls for each bit. The operation of port 1 pins depends upon the pin function selected via the Pin Connect Block. Pins 0 through 15 of port 1 are not available. TRACEPKT0 -- Trace Packet, bit 0. Standard I/O port with internal pull-up. TRACEPKT1 -- Trace Packet, bit 1. Standard I/O port with internal pull-up. TRACEPKT2 -- Trace Packet, bit 2. Standard I/O port with internal pull-up. TRACEPKT3 -- Trace Packet, bit 3. Standard I/O port with internal pull-up. TRACESYNC -- Trace Synchronization. Standard I/O port with internal pull-up.LOW on TRACESYNC while RESET is LOW, enables pins P1.25:16 to operate as Trace port after reset. PIPESTAT0 -- Pipeline Status, bit 0. Standard I/O port with internal pull-up. PIPESTAT1 -- Pipeline Status, bit 1. Standard I/O port with internal pull-up. PIPESTAT2 -- Pipeline Status, bit 2. Standard I/O port with internal pull-up. TRACECLK -- Trace Clock. Standard I/O port with internal pull-up. EXTIN0 -- External Trigger Input. Standard I/O with internal pull-up. RTCK -- Returned Test Clock output. Extra signal added to the JTAG port. Assists debugger synchronization when processor frequency varies. Bi-directional pin with internal pull-up. LOW on RTCK while RESET is LOW, enables pins P1.31:26 to operate as Debug port after reset. TDO -- Test Data out for JTAG interface. TDI -- Test Data in for JTAG interface. TCK -- Test Clock for JTAG interface. TMS -- Test Mode Select for JTAG interface. TRST -- Test Reset for JTAG interface. NC -- Pin not connected. I External Reset input: A LOW on this pin resets the device, causing I/O ports and peripherals to take on their default states, and processor execution to begin at address 0. TTL with hysteresis, 5 V tolerant. Input to the oscillator circuit and internal clock generator circuits. Output from the oscillator amplifier.
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P0.29
14
I I O
P0.30
15
I I I
P1.0 to P1.31
16, 12, 8, 4, 48, 44, 40, 36, 32, 28, 24, 64, 60, 56, 52, 20 16 12 8 4 48
I/O
P1.16 P1.17 P1.18 P1.19 P1.20
O O O O O
P1.21 P1.22 P1.23 P1.24 P1.25 P1.26
44 40 36 32 28 24
O O O O I I/O
P1.27 P1.28 P1.29 P1.30 P1.31 NC RESET
64 60 56 52 20 10 57
O I I I I
XTAL1 XTAL2
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I O
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LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
Table 3: Symbol VSS VSSA VSSA_PLL V18 V18A
Pin description...continued Pin Type Description Ground: 0 V reference. Analog Ground: 0 V reference. This should nominally be the same voltage as VSS, but should be isolated to minimize noise and error. PLL Analog Ground: 0 V reference. This should nominally be the same voltage as VSS, but should be isolated to minimize noise and error. 1.8 V Core Power Supply: This is the power supply voltage for internal circuitry. Analog 1.8 V Core Power Supply: This is the power supply voltage for internal circuitry. This should be nominally the same voltage as V18 but should be isolated to minimize noise and error. 3.3 V Pad Power Supply: This is the power supply voltage for the I/O ports. Analog 3.3 V Pad Power Supply: This should be nominally the same voltage as V3 but should be isolated to minimize noise and error. 6, 18, 25, 42, I 50 59 58 17, 49 63 I I I I
V3 V3A
23, 43, 51 7
I I
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LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
6. Functional description
Details of the LPC2114/LPC2124 systems and peripheral functions are described in the following sections.
6.1 Architectural overview
The ARM7TDMI-S is a general purpose 32-bit microprocessor, which offers high performance and very low power consumption. The ARM architecture is based on Reduced Instruction Set Computer (RISC) principles, and the instruction set and related decode mechanism are much simpler than those of microprogrammed Complex Instruction Set Computers. This simplicity results in a high instruction throughput and impressive real-time interrupt response from a small and cost-effective processor core. Pipeline techniques are employed so that all parts of the processing and memory systems can operate continuously. Typically, while one instruction is being executed, its successor is being decoded, and a third instruction is being fetched from memory. The ARM7TDMI-S processor also employs a unique architectural strategy known as THUMB, which makes it ideally suited to high-volume applications with memory restrictions, or applications where code density is an issue. The key idea behind THUMB is that of a super-reduced instruction set. Essentially, the ARM7TDMI-S processor has two instruction sets:
* The standard 32-bit ARM set. * A 16-bit THUMB set.
The THUMB set's 16-bit instruction length allows it to approach twice the density of standard ARM code while retaining most of the ARM's performance advantage over a traditional 16-bit processor using 16-bit registers. This is possible because THUMB code operates on the same 32-bit register set as ARM code. THUMB code is able to provide up to 65% of the code size of ARM, and 160% of the performance of an equivalent ARM processor connected to a 16-bit memory system.
6.2 On-Chip Flash program memory
The LPC2114/LPC2124 incorporate a 128 kB and 256 kB Flash memory system respectively. This memory may be used for both code and data storage. Programming of the Flash memory may be accomplished in several ways. It may be programmed In System via the serial port. The application program may also erase and/or program the Flash while the application is running, allowing a great degree of flexibility for data storage field firmware upgrades, etc. When on-chip bootloader is used, 120/248 kB of Flash memory is available for user code.
6.3 On-Chip static RAM
On-Chip static RAM may be used for code and/or data storage. The SRAM may be accessed as 8-bits, 16-bits, and 32-bits. The LPC2114/LPC2124 provide 16 kB of static RAM.
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LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
6.4 Memory map
The LPC2114/LPC2124 memory maps incorporate several distinct regions, as shown in the following figures. In addition, the CPU interrupt vectors may be re-mapped to allow them to reside in either Flash memory (the default) or on-chip static RAM. This is described in Section 6.19 "System control".
4.0 GB AHB PERIPHERALS 3.75 GB VPB PERIPHERALS 3.5 GB
0xFFFF FFFF 0xF000 0000 0xEFFF FFFF 0xE000 0000 0xDFFF FFFF
3.0 GB RESERVED ADDRESS SPACE
0xC000 0000
2.0 GB
BOOT BLOCK (RE-MAPPED FROM ON-CHIP FLASH MEMORY
0x8000 0000 0x7FFF FFFF 0x7FFF E000 0x7FFF DFFF
RESERVED ADDRESS SPACE 0x4004 0000 0x4000 3FFF 16 KBYTE ON-CHIP STATIC RAM 1.0 GB 0x4000 0000 0x3FFF FFFF
RESERVED ADDRESS SPACE
0x0004 0000 0x0003 FFFF 256 KBYTE ON-CHIP FLASH MEMORY (LPC2124) 128 KBYTE ON-CHIP FLASH MEMORY (LPC2114) 0.0 GB 0x0002 0000 0x0001 FFFF 0x0000 0000
002aaa661
Fig 3. LPC2114/LPC2124 memory map.
6.5 Interrupt controller
The Vectored Interrupt Controller (VIC) accepts all of the interrupt request inputs and categorizes them as FIQ, vectored IRQ, and non-vectored IRQ as defined by programmable settings. The programmable assignment scheme means that priorities of interrupts from the various peripherals can be dynamically assigned and adjusted.
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Single-chip 16/32-bit microcontrollers
Fast Interrupt reQuest (FIQ) has the highest priority. If more than one request is assigned to FIQ, the VIC combines the requests to produce the FIQ signal to the ARM processor. The fastest possible FIQ latency is achieved when only one request is classified as FIQ, because then the FIQ service routine can simply start dealing with that device. But if more than one request is assigned to the FIQ class, the FIQ service routine can read a word from the VIC that identifies which FIQ source(s) is (are) requesting an interrupt. Vectored IRQs have the middle priority. Sixteen of the interrupt requests can be assigned to this category. Any of the interrupt requests can be assigned to any of the 16 vectored IRQ slots, among which slot 0 has the highest priority and slot 15 has the lowest. Non-vectored IRQs have the lowest priority. The VIC combines the requests from all the vectored and non-vectored IRQs to produce the IRQ signal to the ARM processor. The IRQ service routine can start by reading a register from the VIC and jumping there. If any of the vectored IRQs are requesting, the VIC provides the address of the highest-priority requesting IRQs service routine, otherwise it provides the address of a default routine that is shared by all the non-vectored IRQs. The default routine can read another VIC register to see what IRQs are active. 6.5.1 Interrupt sources Table 4 lists the interrupt sources for each peripheral function. Each peripheral device has one interrupt line connected to the Vectored Interrupt Controller, but may have several internal interrupt flags. Individual interrupt flags may also represent more than one interrupt source.
Table 4: Block WDT ARM Core ARM Core Timer0 Timer1 UART0 Interrupt sources Flag(s) Watchdog Interrupt (WDINT) Reserved for software interrupts only Embedded ICE, DbgCommRx Embedded ICE, DbgCommTx Match 0 - 3 (MR0, MR1, MR2, MR3) Capture 0 - 3 (CR0, CR1, CR2, CR3) Match 0 - 3 (MR0, MR1, MR2, MR3) Capture 0 - 3 (CR0, CR1, CR2, CR3) Rx Line Status (RLS) Transmit Holding Register empty (THRE) Rx Data Available (RDA) Character Time-out Indicator (CTI) UART1 Rx Line Status (RLS) Transmit Holding Register empty (THRE) Rx Data Available (RDA) Character Time-out Indicator (CTI) Modem Status Interrupt (MSI) 7 6 5 VIC channel # 0 1 2 3 4
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Single-chip 16/32-bit microcontrollers
Interrupt sources...continued Flag(s) Match 0 - 6 (MR0, MR1, MR2, MR3, MR4, MR5, MR6) Capture 0 - 3 (CR0, CR1, CR2, CR3) SI (state change) SPIF, MODF SPIF, MODF PLL Lock (PLOCK) RTCCIF (Counter Increment), RTCALF (Alarm) External Interrupt 1 (EINT1) External Interrupt 2 (EINT2) External Interrupt 3 (EINT3) VIC channel # 8 9 10 11 12 13 14 15 16 17 18 19-23
Table 4: Block PWM0 I2C SPI0 SPI1 PLL RTC
System Control External Interrupt 0 (EINT0)
A/D CAN
A/D Converter CAN1, CAN2 and Acceptance Filter
6.6 Pin connect block
The pin connect block allows selected pins of the microcontroller to have more than one function. Configuration registers control the multiplexers to allow connection between the pin and the on chip peripherals. Peripherals should be connected to the appropriate pins prior to being activated, and prior to any related interrupt(s) being enabled. Activity of any enabled peripheral function that is not mapped to a related pin should be considered undefined. The Pin Control Module contains three registers as shown in Table 5.
Table 5: Address 0xE002C000 0xE002C004 0xE002C014 Name PINSEL0 PINSEL1 PINSEL2 Description Pin function select register 0 Pin function select register 1 Pin function select register 2 Access Read/Write Read/Write Read/Write
6.7 Pin function select register 0 (PINSEL0 - 0xE002C000)
The PINSEL0 register controls the functions of the pins as per the settings listed in Table 6. The direction control bit in the IODIR register is effective only when the GPIO function is selected for a pin. For other functions, direction is controlled automatically. Settings other than those shown in Table 6 are reserved, and should not be used
Table 6: PINSEL0 1:0 Pin function select register 0 (PINSEL0 - 0xE002C000) Pin name P0.0 Value 0 0 1 1 0 1 0 1 Function GPIO Port 0.0 TxD (UART0) PWM1 Reserved Value after Reset 0
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LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
Pin function select register 0 (PINSEL0 - 0xE002C000)...continued Pin name P0.1 Value 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Function GPIO Port 0.1 RxD (UART0) PWM3 EINT0 GPIO Port 0.2 SCL (I2C) Capture 0.0 (Timer0) Reserved GPIO Port 0.3 SDA (I2C) Match 0.0 (Timer0) EINT1 GPIO Port 0.4 SCK (SPI0) Capture 0.1 (Timer0) Reserved GPIO Port 0.5 MISO (SPI0) Match 0.1 (Timer0) Reserved GPIO Port 0.6 MOSI (SPI0) Capture 0.2 (Timer0) Reserved GPIO Port 0.7 SSEL (SPI0) PWM2 EINT2 GPIO Port 0.8 TxD UART1 PWM4 Reserved GPIO Port 0.9 RxD (UART1) PWM6 EINT3 GPIO Port 0.10 RTS (UART1) Capture 1.0 (Timer1) Reserved 0 0 0 0 0 0 0 0 0 Value after Reset 0
Table 6: PINSEL0 3:2
5:4
P0.2
0 0 1 1
7:6
P0.3
0 0 1 1
9:8
P0.4
0 0 1 1
11:10
P0.5
0 0 1 1
13:12
P0.6
0 0 1 1
15:14
P0.7
0 0 1 1
17:16
P0.8
0 0 1 1
19:18
P0.9
0 0 1 1
21:20
P0.10
0 0 1 1
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Single-chip 16/32-bit microcontrollers
Pin function select register 0 (PINSEL0 - 0xE002C000)...continued Pin name P0.11 Value 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Function GPIO Port 0.11 CTS (UART1) Capture 1.1 (Timer1) Reserved GPIO Port 0.12 DSR (UART1) Match 1.0 (Timer1) Reserved GPIO Port 0.13 DTR (UART1) Match 1.1 (Timer1) Reserved GPIO Port 0.14 DCD (UART1) EINT1 Reserved GPIO Port 0.15 RI (UART1) EINT2 Reserved 0 0 0 0 Value after Reset 0
Table 6: PINSEL0 23:22
25:24
P0.12
0 0 1 1
27:26
P0.13
0 0 1 1
29:28
P0.14
0 0 1 1
31:30
P0.15
0 0 1 1
6.8 Pin function select register 1 (PINSEL1 - 0xE002C004)
The PINSEL1 register controls the functions of the pins as per the settings listed in Table 7. The direction control bit in the IODIR register is effective only when the GPIO function is selected for a pin. For other functions direction is controlled automatically. Settings other than those shown in the table are reserved, and should not be used.
Table 7: PINSEL1 1:0 Pin function select register 1 (PINSEL1 - 0xE002C004) Pin Name P0.16 Value 0 0 1 1 3:2 P0.17 0 0 1 1 5:4 P0.18 0 0 1 1
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Function 0 1 0 1 0 1 0 1 0 1 0 1 GPIO Port 0.16 EINT0 Match 0.2 (Timer0) Capture 0.2 (Timer0) GPIO Port 0.17 Capture 1.2 (Timer1) SCK (SPI1) Match 1.2 (Timer1) GPIO Port 0.18 Capture 1.3 (Timer1) MISO (SPI1) Match 1.3 (Timer1)
Value after Reset 0
0
0
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Pin function select register 1 (PINSEL1 - 0xE002C004)...continued Pin Name P0.19 Value 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 Function GPIO Port 0.19 Match 1.2 (Timer1) MOSI (SPI1) Capture 1.2 (Timer1) GPIO Port 0.20 Match 1.3 (Timer1) SSEL (SPI1) EINT3 GPIO Port 0.21 PWM5 Reserved Capture 1.3 (Timer1) GPIO Port 0.22 Reserved Capture 0.0 (Timer0) Match 0.0 (Timer0) GPIO Port 0.23 Reserved Reserved Reserved GPIO Port 0.24 Reserved Reserved Reserved GPIO Port 0.25 Reserved Reserved Reserved Reserved Reserved Reserved Reserved GPIO Port 0.27 AIN0 (A/D input 0) Capture 0.1 (Timer0) Match 0.1 (Timer0) GPIO Port 0.28 AIN1 (A/D input 1) Capture 0.2 (Timer0) Match 0.2 (Timer0)
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Table 7: PINSEL1 7:6
Value after Reset 0
9:8
P0.20
0 0 1 1
0
11:10
P0.21
0 0 1 1
0
13:12
P0.22
0 0 1 1
0
15:14
P0.23
0 0 1 1
0
17:16
P0.24
0 0 1 1
0
19:18
P0.25
0 0 1 1
0
21:20
P0.26
0 0 1 1
0
23:22
P0.27
0 0 1 1
0
25:24
P0.28
0 0 1 1
0
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LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
Pin function select register 1 (PINSEL1 - 0xE002C004)...continued Pin Name P0.29 Value 0 0 1 1 0 1 0 1 0 1 0 1 0 1 0 1 Function GPIO Port 0.29 AIN2 (A/D input 2) Capture 0.3 (Timer0) Match 0.3 (Timer0) GPIO Port 0.30 AIN3 (A/D input 0) EINT3 Capture 0.0 (Timer0) Reserved Reserved Reserved Reserved 0 0 Value after Reset 0
Table 7: PINSEL1 27:26
29:28
P0.30
0 0 1 1
31:30
P0.31
0 0 1 1
6.9 Pin function select register 2 (PINSEL2 - 0xE002C014)
The PINSEL2 register controls the functions of the pins as per the settings listed in Table 8. The direction control bit in the IODIR register is effective only when the GPIO function is selected for a pin. For other functions direction is controlled automatically. Settings other than those shown in the table are reserved, and should not be used.
Table 8: 1:0 2 3 31:4 31:30 Pin function select register 2 (PINSEL2 - 0xE002C014) Description Reserved When 0, pins P1.31:26 are GPIO pins. When 1, P1.31:26 are used as Debug port. Reset value 0
PINSEL2 bits
When 0, pins P1.25:16 are used as GPIO pins. When 0 1, P1.25:16 are used as Trace port. Reserved -
6.10 General purpose parallel I/O
Device pins that are not connected to a specific peripheral function are controlled by the GPIO registers. Pins may be dynamically configured as inputs or outputs. Separate registers allow setting or clearing any number of outputs simultaneously. The value of the output register may be read back, as well as the current state of the port pins. 6.10.1 Features
* Direction control of individual bits. * Separate control of output set and clear. * All I/O default to inputs after reset.
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LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
6.11 10-bit A/D converter
The LPC2114/LPC2124 each contain single 10-bit successive approximation analog to digital converter with four multiplexed channels. 6.11.1 Features
* * * *
Measurement range of 0 V to 3 V. Capable of performing more than 400,000 10-bit samples per second. Burst conversion mode for single or multiple inputs. Optional conversion on transition on input pin or Timer Match signal.
6.12 UARTs
The LPC2114/LPC2124 each contain two UARTs. One UART provides a full modem control handshake interface, the other provides only transmit and receive data lines. 6.12.1 Features
* * * * *
16 byte Receive and Transmit FIFOs. Register locations conform to `550 industry standard. Receiver FIFO trigger points at 1, 4, 8, and 14 bytes Built-in baud rate generator. Standard modem interface signals included on UART1.
6.13 I2C serial I/O controller
I2C is a bi-directional bus for inter-IC control using only two wires: a serial clock line (SCL), and a serial data line (SDA). Each device is recognized by a unique address and can operate as either a receiver-only device (e.g. an LCD driver or a transmitter with the capability to both receive and send information (such as memory). Transmitters and/or receivers can operate in either master or slave mode, depending on whether the chip has to initiate a data transfer or is only addressed. I2C is a multi-master bus, it can be controlled by more than one bus master connected to it. I2C implemented in LPC2114/LPC2124 supports bit rate up to 400 kbit/s (Fast I2C). 6.13.1 Features
* Standard I2C compliant bus interface. * Easy to configure as Master, Slave, or Master/Slave. * Programmable clocks allow versatile rate control. * Bidirectional data transfer between masters and slaves. * Multi-master bus (no central master). * Arbitration between simultaneously transmitting masters without corruption of
serial data on the bus.
* Serial clock synchronization allows devices with different bit rates to communicate
via one serial bus.
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Single-chip 16/32-bit microcontrollers
* Serial clock synchronization can be used as a handshake mechanism to suspend
and resume serial transfer.
* The I2C bus may be used for test and diagnostic purposes. 6.14 SPI serial I/O controller
The LPC2114/LPC2124 each contain two SPIs. The SPI is a full duplex serial interface, designed to be able to handle multiple masters and slaves connected to a given bus. Only a single master and a single slave can communicate on the interface during a given data transfer. During a data transfer the master always sends a byte of data to the slave, and the slave always sends a byte of data to the master. 6.14.1 Features
* Compliant with Serial Peripheral Interface (SPI) specification. * Synchronous, Serial, Full Duplex, Communication. * Combined SPI master and slave. * Maximum data bit rate of one eighth of the input clock rate. 6.15 General purpose timers
The Timer is designed to count cycles of the peripheral clock (PCLK) and optionally generate interrupts or perform other actions at specified timer values, based on four match registers. It also includes four capture inputs to trap the timer value when an input signal transitions, optionally generating an interrupt. Multiple pins can be selected to perform a single capture or match function, providing an application with `or' and `and', as well as `broadcast' functions among them. 6.15.1 Features
* A 32-bit Timer/Counter with a programmable 32-bit Prescaler. * Four 32-bit capture channels per timer that can take a snapshot of the timer value
when an input signal transitions. A capture event may also optionally generate an interrupt.
* Four 32-bit match registers that allow:
- Continuous operation with optional interrupt generation on match. - Stop timer on match with optional interrupt generation. - Reset timer on match with optional interrupt generation.
* Four external outputs per timer corresponding to match registers, with the following
capabilities: - Set LOW on match. - Set HIGH on match. - Toggle on match. - Do nothing on match.
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Single-chip 16/32-bit microcontrollers
6.16 Watchdog timer
The purpose of the Watchdog is to reset the microcontroller within a reasonable amount of time if it enters an erroneous state. When enabled, the Watchdog will generate a system reset if the user program fails to `feed' (or reload) the Watchdog within a predetermined amount of time. 6.16.1 Features
* Internally resets chip if not periodically reloaded. * Debug mode. * Enabled by software but requires a hardware reset or a Watchdog reset/interrupt to
be disabled.
* Incorrect/Incomplete feed sequence causes reset/interrupt if enabled. * Flag to indicate Watchdog reset. * Programmable 32-bit timer with internal pre-scaler. * Selectable time period from (tpclk x 256 x 4) to (tpclk x 232 x 4) in multiples of
tpclk x 4.
6.17 Real time clock
The Real Time Clock (RTC) is designed to provide a set of counters to measure time when normal or idle operating mode is selected. The RTC has been designed to use little power, making it suitable for battery powered systems where the CPU is not running continuously (Idle mode). 6.17.1 Features
* Measures the passage of time to maintain a calendar and clock. * Ultra Low Power design to support battery powered systems. * Provides Seconds, Minutes, Hours, Day of Month, Month, Year, Day of Week, and
Day of Year.
* Programmable Reference Clock Divider allows adjustment of the RTC to match
various crystal frequencies.
6.18 Pulse width modulator
The PWM is based on the standard Timer block and inherits all of its features, although only the PWM function is pinned out on the LPC2114/LPC2124. The Timer is designed to count cycles of the peripheral clock (PCLK) and optionally generate interrupts or perform other actions when specified timer values occur, based on seven match registers. The PWM function is also based on match register events. The ability to separately control rising and falling edge locations allows the PWM to be used for more applications. For instance, multi-phase motor control typically requires three non-overlapping PWM outputs with individual control of all three pulse widths and positions.
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Single-chip 16/32-bit microcontrollers
Two match registers can be used to provide a single edge controlled PWM output. One match register (MR0) controls the PWM cycle rate, by resetting the count upon match. The other match register controls the PWM edge position. Additional single edge controlled PWM outputs require only one match register each, since the repetition rate is the same for all PWM outputs. Multiple single edge controlled PWM outputs will all have a rising edge at the beginning of each PWM cycle, when an MR0 match occurs. Three match registers can be used to provide a PWM output with both edges controlled. Again, the MR0 match register controls the PWM cycle rate. The other match registers control the two PWM edge positions. Additional double edge controlled PWM outputs require only two match registers each, since the repetition rate is the same for all PWM outputs. With double edge controlled PWM outputs, specific match registers control the rising and falling edge of the output. This allows both positive going PWM pulses (when the rising edge occurs prior to the falling edge), and negative going PWM pulses (when the falling edge occurs prior to the rising edge). 6.18.1 Features
* Seven match registers allow up to six single edge controlled or three double edge
controlled PWM outputs, or a mix of both types.
* The match registers also allow:
- Continuous operation with optional interrupt generation on match. - Stop timer on match with optional interrupt generation. - Reset timer on match with optional interrupt generation.
* Supports single edge controlled and/or double edge controlled PWM outputs.
Single edge controlled PWM outputs all go HIGH at the beginning of each cycle unless the output is a constant LOW. Double edge controlled PWM outputs can have either edge occur at any position within a cycle. This allows for both positive going and negative going pulses.
* Pulse period and width can be any number of timer counts. This allows complete
flexibility in the trade-off between resolution and repetition rate. All PWM outputs will occur at the same repetition rate.
* Double edge controlled PWM outputs can be programmed to be either positive
going or negative going pulses.
* Match register updates are synchronized with pulse outputs to prevent generation
of erroneous pulses. Software must `release' new match values before they can become effective.
* May be used as a standard timer if the PWM mode is not enabled. * A 32-bit Timer/Counter with a programmable 32-bit Prescaler.
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LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
6.19 System control
6.19.1 Crystal oscillator The oscillator supports crystals in the range of 10 MHz to 25 MHz. The oscillator output frequency is called fosc and the ARM processor clock frequency is referred to as cclk for purposes of rate equations, etc. fosc and cclk are the same value unless the PLL is running and connected. Refer to Section 6.19.2 "PLL" for additional information. 6.19.2 PLL The PLL accepts an input clock frequency in the range of 10 MHz to 25 MHz. The input frequency is multiplied up into the range of 10 MHz to 60 MHz with a Current Controlled Oscillator (CCO). The multiplier can be an integer value from 1 to 32 (in practice, the multiplier value cannot be higher than 6 on this family of microcontrollers due to the upper frequency limit of the CPU). The CCO operates in the range of 156 MHz to 320 MHz, so there is an additional divider in the loop to keep the CCO within its frequency range while the PLL is providing the desired output frequency. The output divider may be set to divide by 2, 4, 8, or 16 to produce the output clock. Since the minimum output divider value is 2, it is insured that the PLL output has a 50% duty cycle.The PLL is turned off and bypassed following a chip Reset and may be enabled by software. The program must configure and activate the PLL, wait for the PLL to Lock, then connect to the PLL as a clock source. 6.19.3 Reset and wake-up timer Reset has two sources on the LPC2114/LPC2124: the RESET pin and Watchdog Reset. The RESET pin is a Schmitt trigger input pin with an additional glitch filter. Assertion of chip Reset by any source starts the Wake-up Timer (see Wake-up Timer description below), causing the internal chip reset to remain asserted until the external Reset is de-asserted, the oscillator is running, a fixed number of clocks have passed, and the on-chip Flash controller has completed its initialization. When the internal Reset is removed, the processor begins executing at address 0, which is the Reset vector. At that point, all of the processor and peripheral registers have been initialized to predetermined values. The wake-up timer ensures that the oscillator and other analog functions required for chip operation are fully functional before the processor is allowed to execute instructions. This is important at power on, all types of Reset, and whenever any of the aforementioned functions are turned off for any reason. Since the oscillator and other functions are turned off during Power-down mode, any wake-up of the processor from Power-down mode makes use of the Wake-up Timer. The Wake-up Timer monitors the crystal oscillator as the means of checking whether it is safe to begin code execution. When power is applied to the chip, or some event caused the chip to exit Power-down mode, some time is required for the oscillator to produce a signal of sufficient amplitude to drive the clock logic. The amount of time depends on many factors, including the rate of VDD ramp (in the case of power on), the type of crystal and its electrical characteristics (if a quartz crystal is used), as well as any other external circuitry (e.g. capacitors), and the characteristics of the oscillator itself under the existing ambient conditions.
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6.19.4
External interrupt inputs The LPC2114/LPC2124 include up to nine edge or level sensitive External Interrupt Inputs as selectable pin functions. When the pins are combined, external events can be processed as four independent interrupt signals. The External Interrupt Inputs can optionally be used to wake up the processor from Power-down mode.
6.19.5
Memory Mapping Control The Memory Mapping Control alters the mapping of the interrupt vectors that appear beginning at address 0x00000000. Vectors may be mapped to the bottom of the on-chip Flash memory, or to the on-chip static RAM. This allows code running in different memory spaces to have control of the interrupts.
6.19.6
Power Control The LPC2114/LPC2124 support two reduced power modes: Idle mode and Power-down mode. In Idle mode, execution of instructions is suspended until either a Reset or interrupt occurs. Peripheral functions continue operation during Idle mode and may generate interrupts to cause the processor to resume execution. Idle mode eliminates power used by the processor itself, memory systems and related controllers, and internal buses. In Power-down mode, the oscillator is shut down and the chip receives no internal clocks. The processor state and registers, peripheral registers, and internal SRAM values are preserved throughout Power-down mode and the logic levels of chip output pins remain static. The Power-down mode can be terminated and normal operation resumed by either a Reset or certain specific interrupts that are able to function without clocks. Since all dynamic operation of the chip is suspended, Power-down mode reduces chip power consumption to nearly zero. A Power Control for Peripherals feature allows individual peripherals to be turned off if they are not needed in the application, resulting in additional power savings.
6.19.7
VPB bus The VPB Divider determines the relationship between the processor clock (cclk) and the clock used by peripheral devices (PCLK). The VPB Divider serves two purposes. The first is that the VPB bus cannot operate at the highest speeds of the CPU. In order to compensate for this, the VPB bus may be slowed down to one half or one fourth of the processor clock rate. The default condition at reset is for the VPB bus to run at one quarter of the CPU clock. The second purpose of the VPB Divider is to allow power savings when an application does not require any peripherals to run at the full processor rate. Because the VPB Divider is connected to the PLL output, the PLL remains active (if it was running) during Idle mode.
6.20 Emulation and debugging
The LPC2114/LPC2124 support emulation and debugging via a JTAG serial port. A trace port allows tracing program execution. Debugging and trace functions are multiplexed only with GPIOs on Port 1. This means that all communication, timer and interface peripherals residing on Port 0 are available during the development and debugging phase as they are when the application is run in the embedded system itself.
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Single-chip 16/32-bit microcontrollers
6.20.1
Embedded ICETM Standard ARM EmbeddedICE logic provides on-chip debug support. The debugging of the target system requires a host computer running the debugger software and an EmbeddedICE protocol convertor. EmbeddedICE protocol convertor converts the Remote Debug Protocol commands to the JTAG data needed to access the ARM core. The ARM core has a Debug Communication Channel function built-in. The debug communication channel allows a program running on the target to communicate with the host debugger or another separate host without stopping the program flow or even entering the debug state. The debug communication channel is accessed as a co-processor 14 by the program running on the ARM7TDMI-S core. The debug communication channel allows the JTAG port to be used for sending and receiving data without affecting the normal program flow. The debug communication channel data and control registers are mapped in to addresses in the EmbeddedICETM logic.
6.20.2
Embedded trace Since the LPC2114/LPC2124 have significant amounts of on-chip memory, it is not possible to determine how the processor core is operating simply by observing the external pins. The Embedded Trace Macrocell provides real-time trace capability for deeply embedded processor cores. It outputs information about processor execution to the trace port. The ETM is connected directly to the ARM core and not to the main AMBA system bus. It compresses the trace information and exports it through a narrow trace port. An external trace port analyzer must capture the trace information under software debugger control. Instruction trace (or PC trace) shows the flow of execution of the processor and provides a list of all the instructions that were executed. Instruction trace is significantly compressed by only broadcasting branch addresses as well as a set of status signals that indicate the pipeline status on a cycle by cycle basis. Trace information generation can be controlled by selecting the trigger resource. Trigger resources include address comparators, counters and sequencers. Since trace information is compressed the software debugger requires a static image of the code being executed. Self-modifying code can not be traced because of this restriction.
6.20.3
RealMonitorTM RealMonitor is a configurable software module, developed by ARM Inc., which enables real time debug. It is a lightweight debug monitor that runs in the background while users debug their foreground application. It communicates with the host using the DCC (Debug Communications Channel), which is present in the EmbeddedICE logic. The LPC2114/LPC2124 contain a specific configuration of RealMonitor software programmed into the on-chip Flash memory.
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7. Limiting values
Table 9: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V18 V3 V3A AVIN Vi Vi I I Tstg P Supply voltage, internal rail Supply voltage, external rail Analog 3.3 V pad supply voltage Analog input voltage on A/D related pins DC input voltage, 5 V tolerant I/O pins[3][4] DC input voltage, other I/O pins[2][3] DC supply current per supply pin[5] DC ground current per ground Storage temperature[6] pin[5] Conditions Min -0.5 -0.5 -0.5 -0.5 -0.5 -0.5 -40 1.5 Max +2.5 +3.6 4.6 5.1 6.0 Unit V V V V V
V3 + 0.5 V 100 100 125 mA mA C W
Power dissipation (based on package heat transfer, not device power consumption)
[1]
[2] [3] [4] [5] [6]
The following applies to the Limiting values: a) Stresses above those listed under Limiting values may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in Section 8 "Static characteristics" and Section 9 "Dynamic characteristics" of this specification is not implied. b) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. c) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. Not to exceed 4.6 V. Including voltage on outputs in 3-state mode. Only valid when the V3 supply voltage is present. The peak current is limited to 25 times the corresponding maximum current. Dependent on package type.
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8. Static characteristics
Table 10: Static characteristics Tamb = -40 C to +85 C for commercial, unless otherwise specified. Symbol Parameter V18 V3 V3A Supply voltage External rail supply voltage Analog 3.3 V pad supply voltage Low level input current, no pull-up High level input current, no pull down 3-state output leakage, no pull-up/down I/O latch-up current Input voltage[3][4][5] Output voltage, output active High level input voltage Low level input voltage Hysteresis voltage High level output Low level output voltage[6] voltage[6] IOH = -4 mA IOL = -4 mA VOH = V3 - 0.4 V VOL = 0.4 V VOH = 0 VOL = V3 Vi = 5 V[8] Vi = 0 V3 < Vi< 5 V[8] V18 = 1.8 V, cclk = 60 MHz, Tamb = 25 C, code while(1){} executed from FLASH, no active peripherals Power-down Mode I2C VIH VIL Vhys
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Conditions
Min 1.65 3.0 2.5
Typ[1] 1.8 3.3 3.3
Max 1.95 3.6 3.6
Unit V V V
Standard Port pins, RESET, RTCK IIL IIH IOZ Ilatchup Vi Vo VIH VIL Vhys VOH VOL IOH IOL IOH IOL IPD IPU I18 Vi = 0 Vi = V3 Vo = 0, Vo = V3 -(0.5 V3) < V < (1.5 V3) Tj < 125 C 0 0 2.0 V3 - 0.4 -4 4 10 -15 0 0.4 50 -50 0 30 5.5 V3 0.8 0.4 -45 50 150 -85 0 V V V V V V V mA mA mA mA A A A mA 100 3 3 3 A A A mA
High level output current[6] Low level output current[6] High level short circuit current[7] Low level short circuit current[7] Pull-down current Pull-up current (applies to P1.16 - P1.25) Active Mode
V18 = 1.8 V, Tamb = +25 C, V18 = 1.8 V, Tamb = +85 C
0.7 VTOL -
10 50 0.5 VTOL
500 0.3 VTOL -
A A V V V
pins High level input voltage Low level input voltage Hysteresis voltage VTOL is from 4.5 V to 5.5 V VTOL is from 4.5 V to 5.5 V VTOL is from 4.5 V to 5.5 V
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Table 10: Static characteristics...continued Tamb = -40 C to +85 C for commercial, unless otherwise specified. Symbol Parameter VOL Ilkg Low level output voltage[6] Input leakage to VSS Conditions IOL = 3 mA Vi = V3 Vi = 5 V Oscillator pins X1 input Voltages X2 output Voltages
[1] [2] [3] [4] [5] [6] [7] [8]
Min 0 0
Typ[1] 2 10 -
Max 0.4 4 22 V18 V18
Unit V A A
Typical ratings are not guaranteed. The values listed are at room temperature (+25 C), nominal supply voltages. Pin capacitance is characterized but not tested. Including voltage on outputs in 3-state mode. V3 supply voltages must be present. 3-state outputs go into 3-state mode when V3 is grounded. Accounts for 100 mV voltage drop in all supply lines. Only allowed for a short time period. Minimum condition for Vi = 4.5 V, maximum condition for Vi = 5.5 V.
Table 11: A/D converter DC electrical characteristics V3A = 2.5 V to 3.6 V unless otherwise specified; Tamb = -40 C to +85 C unless otherwise specified; A/D converter frequency 4.5 MHz. Symbol AVIN CIN DLe ILe OSe Ge Ae
[1] [2] [3] [4] [5] [6] [7]
Parameter Analog input voltage Analog input capacitance Differential Integral Gain non-linearity[1][2][3] non-linearity[1][4]
Min 0 -
Max V3A 1 1 2 3 0.5 4
Unit V pF LSB LSB LSB % LSB
Offset error[1][5] error[1][6] error[1][7] Absolute
Conditions: VSSA = 0 V, V3A = 3.3 V. The A/D is monotonic, there are no missing codes. The differential non-linearity (DLe) is the difference between the actual step width and the ideal step width. See Figure 4. The integral no-linearity (ILe) is the peak difference between the center of the steps of the actual and the ideal transfer curve after appropriate adjustment of gain and offset errors. See Figure 4. The offset error (OSe) is the absolute difference between the straight line which fits the actual curve and the straight line which fits the ideal curve. See Figure 4. The gain error (Ge) is the relative difference in percent between the straight line fitting the actual transfer curve after removing offset error, and the straight line which fits the ideal transfer curve. See Figure 4. The absolute voltage error (Ae) is the maximum difference between the center of the steps of the actual transfer curve of the non-calibrated A/D and the ideal transfer curve. See Figure 4.
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Single-chip 16/32-bit microcontrollers
offset error OSe 1023
gain error Ge
1022
1021
1020
1019
1018 (2)
7 Code out 6 (1)
5 (5) 4 (4) 3 (3) 2
1
1 LSB (ideal) 1018 1019 1020 1021 1022 1023 1024
0 1 2 3 4 5 6 7 AVIN (LSBideal) offset error OSe
1 LSB =
V3A - VSSA 1024
002aaa668
(1) Example of an actual transfer curve. (2) The ideal transfer curve. (3) Differential non-linearity (DLe). (4) Integral non-linearity (ILe). (5) Center of a step of the actual transfer curve.
Fig 4. A/D conversion characteristics.
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Single-chip 16/32-bit microcontrollers
9. Dynamic characteristics
Table 12: Characteristics Tamb = 0 C to +70 C for commercial, -40 C to +85 C for industrial, V18, V3 over specified ranges[1] Symbol External Clock fosc tC tCHCX tCLCX tCLCH tCHCL Port Pins tRISE tFALL I2C pins tf Output fall time from VIH to VIL 20 + 0.1 x Cb[2] ns Port output rise time (except P0.2, P0.3) Port output fall time (except P0.2, P0.3) 10 10 ns ns Oscillator frequency Oscillator clock period Clock high time Clock low time Clock rise time Clock fall time 10 40 tc x 0.4 tc x 0.4 25 100 5 5 MHz ns ns ns ns ns Parameter Conditions Min Typ[1] Max Unit
[1] [2]
Parameters are valid over operating temperature range unless otherwise specified. Bus capacitance Cb in pF, from 10 pF to 400 pF.
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Preliminary data
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Philips Semiconductors
LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
9.1 Timing
VDD - 0.5 V 0.45 V
0.2 VDD + 0.9 0.2 VDD - 0.1 V tCHCX
tCHCL
tCLCX
tC
tCLCH
002aaa416
Fig 5. External clock timing.
9397 750 12327
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LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
10. Package outline
LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm SOT314-2
c
y X A 48 49 33 32 ZE
e E HE wM bp 64 1 pin 1 index 16 ZD bp D HD wM B vM B vM A 17 detail X L Lp A A2 A1 (A 3)
e
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.6 A1 0.20 0.05 A2 1.45 1.35 A3 0.25 bp 0.27 0.17 c 0.18 0.12 D (1) 10.1 9.9 E (1) 10.1 9.9 e 0.5 HD HE L 1 Lp 0.75 0.45 v 0.2 w 0.12 y 0.1 Z D (1) Z E (1) 1.45 1.05 1.45 1.05 7 0o
o
12.15 12.15 11.85 11.85
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT314-2 REFERENCES IEC 136E10 JEDEC MS-026 JEITA EUROPEAN PROJECTION
ISSUE DATE 00-01-19 03-02-25
Fig 6.
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Preliminary data
Rev. 01 -- 18 November 2003
30 of 36
Philips Semiconductors
LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
11. Soldering
11.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. In these situations reflow soldering is recommended.
11.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept:
* below 225 C (SnPb process) or below 245 C (Pb-free process)
- for all BGA, HTSSON..T and SSOP..T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages.
* below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
11.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
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LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
* For packages with leads on two sides and a pitch (e):
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle
to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
11.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
11.5 Package related soldering information
Table 13: Package[1] BGA, HTSSON..T[3], LBGA, LFBGA, SQFP, SSOP..T[3], TFBGA, USON, VFBGA Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave not suitable Reflow[2] suitable suitable
DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, not suitable[4] HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC[5], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L[8],
[1] [2]
suitable not WQCCN..L[8] recommended[5][6] not recommended[7] not suitable
suitable suitable suitable not suitable
PMFP[9],
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.
(c) Koninklijke Philips Electronics N.V. 2003. All rights reserved.
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Preliminary data
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Philips Semiconductors
LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages.
[3]
[4]
[5] [6] [7] [8]
[9]
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Preliminary data
Rev. 01 -- 18 November 2003
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Philips Semiconductors
LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
12. Revision history
Table 14: Rev Date 01 20031118 Revision history CPCN Description Preliminary data (9397 750 12327)
9397 750 12327
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Preliminary data
Rev. 01 -- 18 November 2003
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Philips Semiconductors
LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
13. Data sheet status
Level I II Data sheet status[1] Objective data Preliminary data Product status[2][3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
14. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
16. Licenses
Purchase of Philips I2C components Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
15. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
17. Trademarks
RealMonitor -- is a trademark of ARM, Inc. EmbeddedICE -- is a trademark of ARM, Inc. ARM7TDMI-S -- is a trademark of ARM, Inc. SPI -- is a trademark of Motorola, Inc.
Contact information
For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com.
9397 750 12327
Fax: +31 40 27 24825
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Preliminary data
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Philips Semiconductors
LPC2114/LPC2124
Single-chip 16/32-bit microcontrollers
Contents
1 2 2.1 3 3.1 4 5 5.1 5.2 6 6.1 6.2 6.3 6.4 6.5 6.5.1 6.6 6.7 6.8 6.9 6.10 6.10.1 6.11 6.11.1 6.12 6.12.1 6.13 6.13.1 6.14 6.14.1 6.15 6.15.1 6.16 6.16.1 6.17 6.17.1 6.18 6.18.1 6.19 6.19.1 6.19.2 6.19.3 6.19.4 6.19.5 6.19.6 6.19.7 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Key features . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 9 Architectural overview. . . . . . . . . . . . . . . . . . . . 9 On-Chip Flash program memory . . . . . . . . . . . 9 On-Chip static RAM . . . . . . . . . . . . . . . . . . . . . 9 Memory map. . . . . . . . . . . . . . . . . . . . . . . . . . 10 Interrupt controller . . . . . . . . . . . . . . . . . . . . . 10 Interrupt sources. . . . . . . . . . . . . . . . . . . . . . . 11 Pin connect block . . . . . . . . . . . . . . . . . . . . . . 12 Pin function select register 0 (PINSEL0 - 0xE002C000). . . . . . . . . . . . . . . . . . . . . . . . 12 Pin function select register 1 (PINSEL1 - 0xE002C004). . . . . . . . . . . . . . . . . . . . . . . . 14 Pin function select register 2 (PINSEL2 - 0xE002C014). . . . . . . . . . . . . . . . . . . . . . . . 16 General purpose parallel I/O. . . . . . . . . . . . . . 16 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 10-bit A/D converter . . . . . . . . . . . . . . . . . . . . 17 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 UARTs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 I2C serial I/O controller . . . . . . . . . . . . . . . . . . 17 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 SPI serial I/O controller. . . . . . . . . . . . . . . . . . 18 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 General purpose timers . . . . . . . . . . . . . . . . . 18 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Watchdog timer. . . . . . . . . . . . . . . . . . . . . . . . 19 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Real time clock . . . . . . . . . . . . . . . . . . . . . . . . 19 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Pulse width modulator . . . . . . . . . . . . . . . . . . 19 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 System control . . . . . . . . . . . . . . . . . . . . . . . . 21 Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . . 21 PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Reset and wake-up timer . . . . . . . . . . . . . . . . 21 External interrupt inputs . . . . . . . . . . . . . . . . . 22 Memory Mapping Control . . . . . . . . . . . . . . . . 22 Power Control . . . . . . . . . . . . . . . . . . . . . . . . . 22 VPB bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 6.20 6.20.1 6.20.2 6.20.3 7 8 9 9.1 10 11 11.1 11.2 11.3 11.4 11.5 12 13 14 15 16 17 Emulation and debugging. . . . . . . . . . . . . . . . Embedded ICETM . . . . . . . . . . . . . . . . . . . . . . Embedded trace. . . . . . . . . . . . . . . . . . . . . . . RealMonitorTM . . . . . . . . . . . . . . . . . . . . . . . . Limiting values . . . . . . . . . . . . . . . . . . . . . . . . Static characteristics . . . . . . . . . . . . . . . . . . . Dynamic characteristics . . . . . . . . . . . . . . . . . Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Package outline . . . . . . . . . . . . . . . . . . . . . . . . Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . Manual soldering . . . . . . . . . . . . . . . . . . . . . . Package related soldering information . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Data sheet status. . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . Licenses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 23 23 23 24 25 28 29 30 31 31 31 31 32 32 34 35 35 35 35 35
(c) Koninklijke Philips Electronics N.V. 2003. Printed in the U.S.A.
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 18 November 2003 Document order number: 9397 750 12327

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